PCB Assembly

Surface Mount Assembly – SMT

• Tin Lead or RoHS Compliant
• High Speed Pick and Place
• High Volume Production – up to 120,000 placements per hour
• Single and Double Sided SMT assembly
• Min. pitch 0.3mm placement
• SMD packages down to 0201
• Largest component: QFP & BGA’s to 55 x 55mm
• Multi-Zone Convection Reflow Ovens
• Automatic (Vision) Screen Printing
• Max PCB panel size: 460mm L x 400mm W
• 3D AOI (Automatic Optical Inspection)
• Component X-Ray

Through Hole Assembly

Duet Electronics is able to handle a wide range of capabilities that add value to your product. One of these capabilities is our Through Hole technology assembly capability which allows for assembly with the use of laser guided tables. Duet Electronics through hole operations also utilize state-of-the-art component prep equipment. Nitrogen Selective Soldering further complements our through hole assembly processes enabling Duet Electronics to be completely lead-free RoHS compliant.