Encapsulation

Encapsulation or as it is commonly known as, potting, consists of immersing an individual component or complete assembly in a liquid resin, and then curing it.

The process is done using a pre-moulded potting shell, or directly in a mould. Encapsulation is mainly used to protect electronics from moisture and mechanical damage.

It is also used in high voltage applications to isolate live components allowing them to be placed in closer proximity to other components. We use a number of different types of materials and techniques to achieve the best encapsulation results, these include Various Epoxies, Silicone, Polyimide, Over Moulding and our own Low Pressure Moulding Technology and Macromelt.